Home > Newly Shipped PCB > RO3010 2-Layer 25mil ENIG PCB for High-Dk RF Applications

 

RO3010 2-Layer 25mil ENIG PCB for High-Dk RF Applications


1.Introduction of RO3010

Rogers RO3010 advanced circuit materials are ceramic-filled PTFE composites that offer a higher dielectric constant with excellent stability. They are competitively priced products with exceptional mechanical and electrical stability. This stability simplifies the design of broadband components and allows the materials to be used in a wide range of applications over a very broad range of frequencies. This material's characteristics make RO3010 laminates excellent for circuit miniaturization.


2.Key Features

High Dielectric Constant: 10.2 ±0.30 at 10 GHz/23°C
Low Loss Performance: Dissipation factor of 0.0022 at 10 GHz/23°C
Excellent Thermal Stability: CTE 13 ppm/°C (X), 11 ppm/°C (Y), 16 ppm/°C (Z) from -55 to 288°C
High Temperature Resistance: Td > 500°C
Effective Thermal Management: Thermal Conductivity of 0.95 W/mK
Environmental Durability: Moisture Absorption of 0.05%
Wide Operating Range: -40°C to +85°C operation


3.Benefits

Dimensional Reliability: Material exhibits dimensional stability with expansion coefficient matched to copper
Cost Efficiency: Economical laminate pricing for volume manufacturing process
Quality Assurance: ISO 9001 Certified
Design Versatility: Suitable for use with multi-layer board designs



4.PCB Construction Details

Parameter Specification
Base Material RO3010
Layer Count 2-layer
Board Dimensions 45mm × 65mm = 1PC
Minimum Trace/Space 4/4 mils
Minimum Hole Size 0.3mm
Finished Board Thickness 0.8mm
Finished Cu Weight 1oz (1.4 mils) outer layers
Via Plating Thickness 20 μm
Surface Finish Immersion Gold
Top Silkscreen Black
Bottom Silkscreen No
Top Solder Mask No
Bottom Solder Mask No
Electrical Test 100% tested prior to shipment

5.PCB Stackup (12-Layer Rigid Structure)

Copper Layer 1 - 35 μm
Rogers RO3010 Substrate - 25mil (0.635mm)
Copper Layer 2 - 35 μm


6.PCB Statistics:

Components: 11
Total Pads: 31
Thru Hole Pads: 21
Top SMT Pads: 10
Bottom SMT Pads: 0
Vias: 12
Nets: 2


7.Typical Applications

Automotive radar applications
Global positioning satellite antennas
Cellular telecommunications systems - power amplifiers and antennas
Patch antenna for wireless communications
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes


8.Quality Assurance

Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide


 

Previous RO3203 2-Layer 10mil ENEPIG PCB for High-Frequency Wireless Systems

Next Astra MT77 2-Layer 10mil ENIG PCB for Automotive Radar Applications